MK22FN512VFX12 — Kinetis K20 ARM Cortex-M4 MCU for industrial control
It packs 512 KB Flash and 128 KB RAM on a single die, with a full-speed USB OTG controller, dual 16-bit ADCs, and a 12-bit DAC. The part is housed in an 88-QFN with exposed pad for thermal dissipation and operates from 1.71 V to 3.6 V over the -40°C to 105°C industrial temperature range.
QFN package and thermal management
The exposed pad is electrically connected to the die substrate — typically tied to ground. The 60 general-purpose I/O are distributed around the four sides; the USB OTG differential pair is on dedicated pins with controlled impedance routing recommended. Mount the part on a 4-layer PCB with a solid ground plane beneath the QFN for best EMI and thermal performance.