MIMXRT1166DVM6A

NXP USA Inc.

NXP i.MX RT1166 crossover MCU, MIMXRT1166DVM6A, 32-bit dual-core ARM Cortex-M4 at 240 MHz and Cortex-M7 at 600 MHz, 1M x 8 RAM, external program memory, 289-LFBGA (14x14), 0°C to 95°C, 2.4V–3.6V supply.

NXP USA Inc. MIMXRT1166DVM6A
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MOQ 1 · Tray · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

MIMXRT1166DVM6A specifications
Parameter / AttributeSpecification / Value
Seriesi.MX
MountingSurface Mount
Oscillator typeInternal
Program memory typeExternal Program Memory
Voltage - supply (Vcc (Vdd))2.4V ~ 3.6V
Operating temperature0°C ~ 95°C (TJ)
Speed240MHz, 600MHz
PackageTray
RAM size1M x 8
Core size32-Bit Dual-Core
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Core processorARM® Cortex®-M4/M7
Case289-LFBGA
Data convertersA/D 2x12b; D/A 1x12b

Technical details

Dual-core crossover MCU for real-time and application processing

The NXP MIMXRT1166DVM6A is a 32-bit dual-core crossover MCU from the i.MX series, combining an ARM Cortex-M7 core running at 600 MHz with a Cortex-M4 core at 240 MHz. This asymmetric architecture lets one chip handle both deterministic control loops (M4) and high-throughput application code (M7).

The 600 MHz Cortex-M7 handles the heavy lifting — graphics, networking stacks, signal processing — while the 240 MHz Cortex-M4 runs time-critical tasks like PWM updates, encoder capture, or fault-response routines. This avoids the interrupt-latency jitter that can hit a single-core part when the main loop is busy with Ethernet traffic. If you are migrating from a single-core Cortex-M7 at 600 MHz, the M4 core effectively gives you a dedicated real-time coprocessor without adding a second chip.

Rated 0°C to 95°C (junction), this part is suited for indoor equipment — factory controllers, commercial gateways, test instrumentation — not for under-hood automotive or outdoor enclosures without active cooling. The 289-LFBGA (14x14 mm) package demands controlled soldering profiles and X-ray inspection; it is not a field-swap part. Plan for a production reflow oven and a board-level test step.

Memory and program storage

Program memory is external — the chip boots from SPI NOR Flash, NAND, or SD/eMMC via the EBI/EMI or SDIO interfaces. The 1M x 8 on-chip RAM is enough for code scratch and data buffers.

Lifecycle status is Active, so factory supply is normal — no last-time-buy or obsolescence pressure for current designs.

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