LPC4370FET100K

NXP USA Inc.

NXP LPC43xx series, LPC4370FET100K, 32-Bit Tri-Core ARM Cortex-M4/M0/M0 MCU, 204MHz, ROMless, 282K x 8 SRAM, 49 I/O, 100-TFBGA (9x9mm), Ethernet/CAN/USB/I2C/SPI, 2.2V~3.6V, -40°C~85°C, Active, Tray.

NXP USA Inc. LPC4370FET100K
Download datasheet (PDF)
[IN STOCK] In Stock: 16 pcs
$15.26/ pc

Volume pricing

Buy Now

MOQ 1 · Tray · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

LPC4370FET100K specifications
Parameter / AttributeSpecification / Value
SeriesLPC43xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeROMless
Voltage - supply (Vcc (Vdd))2.2V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed204MHz
PackageTray
RAM size282K x 8
Core size32-Bit Tri-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, SSC, UART/USART, USB
Number of i (O)49
Core processorARM® Cortex®-M4/M0/M0
Case100-TFBGA
Data convertersA/D 3x12b SAR; D/A 1x10b

Technical details

Tri-core architecture — what it buys you

The LPC4370FET100K runs a 32-bit ARM Cortex-M4 for DSP/number-crunch paired with two Cortex-M0 cores for peripheral and communications offload. At 204 MHz the M4 handles the control loop or audio processing while the M0s manage Ethernet, CAN, USB, and the EBI/EMI bus without stealing cycles. That asymmetric multiprocessing is the main reason to pick this over a single-core MCU in the same BGA footprint.

Memory and I/O — what's on board

282K x 8 SRAM is the only internal memory; no Flash is on-chip. Code must execute from external memory via the EBI/EMI or SPI interface.

LPC4370FET100K
[ALLOC] verified
Quote