NXP LPC4370FET100E Tri-Core MCU, 204MHz, 100-TFBGA
NXP LPC4370 tri-core MCU, ARM Cortex-M4/M0/M0 at 204MHz, 282KB SRAM, ROMless, Ethernet/CAN/USB/SPI/SSC, 2.2–3.6V, -40°C to 85°C, 100-TFBGA (9×9mm) tray, active lifecycle.
Specifications
| Parameter | Value |
|---|---|
| Series | LPC43xx |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | ROMless |
| Voltage - supply (Vcc (Vdd)) | 2.2V ~ 3.6V |
| Operating temperature | -40°C ~ 85°C (TA) |
| Speed | 204MHz |
| Package | Tray |
| RAM size | 282K x 8 |
| Core size | 32-Bit Tri-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, SSC, UART/USART, USB |
| Number of i (O) | 49 |
| Core processor | ARM® Cortex®-M4/M0/M0 |
| Case | 100-TFBGA |
| Data converters | A/D 3x12b; D/A 1x10b |
Frequently asked questions
Does the LPC4370FET100E need external flash to boot?
Yes. The LPC4370FET100E is ROMless and requires external non-volatile memory for boot code. The EBI/EMI interface supports parallel NOR flash, and the SPIFI interface allows SPI flash to execute in place. External memory must be selected and included on the BOM.
Does the LPC4370FET100E have an internal Ethernet PHY?
No. The Ethernet MAC is integrated, but an external PHY is required. The MAC communicates over MII/RMII to an external Ethernet PHY such as a MagJack assembly with auto-MDIX.
What is the package and lead time situation for the LPC4370FET100E?
The LPC4370FET100E ships in a 100-TFBGA (9×9mm) tray. The part is quoted to order through authorized distribution; tray quantities govern minimum order increments for production. Panel builders need BGA rework capability for any unit-level rework. Lead time and allocation status against your volume window are confirmed via RFQ.