Dual-core architecture for partitioned control
On-chip memory includes 1 MB of Flash and 136 KB of SRAM, plus 16 KB of EEPROM for calibration constants or boot parameters that survive a firmware update. The Flash footprint accommodates a full TCP/IP stack, a USB host stack, and a small GUI frame buffer without external memory.
Connectivity and peripheral set for industrial nodes
Data conversion is handled by an 8-channel 10-bit ADC and a single 10-bit DAC — adequate for current-sense feedback and analog set-point generation, though higher-resolution external ADCs are needed for precision instrumentation.
Housed in a 256-ball LBGA measuring 17x17 mm, the part demands a controlled PCB stack-up with via-in-pad or microvia fanout for the fine-pitch balls. X-ray inspection is recommended after reflow; hand-soldering is not practical. The industrial temperature range (-40 to 85 °C) covers most factory-floor and outdoor telecom enclosures without active cooling. Supply voltage spans 2.2 V to 3.6 V.