
NXP LPC3250FET296,551 ARM926EJ-S MCU, 266 MHz, 296-TFBGA, Obsolete
NXP LPC3200 series, ARM926EJ-S core running at 266 MHz, ROMless external-memory architecture, 0.9–3.6 V single-supply, 51 I/O, 3×10-bit ADC, 256K×8 SRAM, 296-TFBGA 15×15 mm Tray.
Specifications
| Parameter | Value |
|---|---|
| Series | LPC3200 |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | ROMless |
| Voltage - supply (Vcc (Vdd)) | 0.9V ~ 3.6V |
| Operating temperature | -40°C ~ 85°C (TA) |
| Speed | 266MHz |
| Package | Tray |
| RAM size | 256K x 8 |
| Core size | 16/32-Bit |
| Peripherals | DMA, I²S, LCD, Motor Control PWM, PWM, WDT |
| Connectivity | EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG |
| Number of i (O) | 51 |
| Core processor | ARM926EJ-S |
| Case | 296-TFBGA |
| Data converters | A/D 3x10b |
Frequently asked questions
Does the ROMless LPC3250FET296,551 require external flash to boot?
Yes — the part boots from external memory over the EBI/EMI bus. A companion external NOR or NAND flash device is mandatory on the BOM; the minimum qualified boot-memory device is documented in the NXP LPC3250 user manual, not the order-code ledger.
What supply voltage does this part need?
0.9 V to 3.6 V single rail. The wide range accommodates 3.3 V industrial logic directly, but at 266 MHz the dynamic current draw under full load at 85 °C ambient requires thermal management via the TFBGA bottom-pad land pattern and PCB ground-plane stitching.