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NXP USA Inc. LPC3250FET296,551 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC3250FET296,551 ARM926EJ-S MCU, 266 MHz, 296-TFBGA, Obsolete

MPNLPC3250FET296,551
Obsolete

NXP LPC3200 series, ARM926EJ-S core running at 266 MHz, ROMless external-memory architecture, 0.9–3.6 V single-supply, 51 I/O, 3×10-bit ADC, 256K×8 SRAM, 296-TFBGA 15×15 mm Tray.

$351.4800Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LPC3250FET296,551 specifications
ParameterValue
SeriesLPC3200
MountingSurface Mount
Oscillator typeInternal
Program memory typeROMless
Voltage - supply (Vcc (Vdd))0.9V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed266MHz
PackageTray
RAM size256K x 8
Core size16/32-Bit
PeripheralsDMA, I²S, LCD, Motor Control PWM, PWM, WDT
ConnectivityEBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Number of i (O)51
Core processorARM926EJ-S
Case296-TFBGA
Data convertersA/D 3x10b

Frequently asked questions

Does the ROMless LPC3250FET296,551 require external flash to boot?

Yes — the part boots from external memory over the EBI/EMI bus. A companion external NOR or NAND flash device is mandatory on the BOM; the minimum qualified boot-memory device is documented in the NXP LPC3250 user manual, not the order-code ledger.

What supply voltage does this part need?

0.9 V to 3.6 V single rail. The wide range accommodates 3.3 V industrial logic directly, but at 266 MHz the dynamic current draw under full load at 85 °C ambient requires thermal management via the TFBGA bottom-pad land pattern and PCB ground-plane stitching.