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NXP USA Inc. LPC2939FBD208,551 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC2939FBD208,551 ARM9 MCU, 125 MHz, 768 KB Flash, NRND

MPNLPC2939FBD208,551
NRND

NXP LPC2900 series ARM9® MCU, LPC2939FBD208,551, 16/32-Bit core, 125 MHz, 768 KB Flash, 56K x 8 RAM, 16K x 8 EEPROM, USB OTG, CAN, 152 I/O, 208-LQFP, -40 to 85 °C.

$23.6806Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LPC2939FBD208,551 specifications
ParameterValue
SeriesLPC2900
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.71V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed125MHz
PackageTray
RAM size56K x 8
Core size16/32-Bit
EEPROM size16K x 8
PeripheralsDMA, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Number of i (O)152
Core processorARM9®
Case208-LQFP
Data convertersA/D 24x10b
Program memory size768KB (768K x 8)

Product details

ARM9 MCU with USB OTG and CAN — what this part delivers

The NXP LPC2939FBD208,551 is a 16/32-bit ARM9 microcontroller running at 125 MHz, with 768 KB of on-chip Flash, 56 KB of RAM, and 16 KB of EEPROM. The 208-LQFP package (28x28 mm) provides 152 general-purpose I/O, making it suitable for industrial control, motor drive, and communication gateway applications where a single-chip ARM9 core with both USB host/device and CAN is needed.

125 MHz ARM9 — timing and throughput

The 125 MHz core speed positions this part in the mid-range ARM9 tier — enough for protocol bridging, sensor fusion, or HMI control loops, but not for high-rate video or DSP workloads. The 768 KB Flash is sized for moderate firmware images with room for a bootloader and application code; the 56 KB RAM handles typical stack and buffer needs for CAN and USB stacks without external memory, though the EBI/EMI interface allows expansion if needed.

NRND — sourcing reality for this MCU

NXP has designated the LPC2939FBD208,551 as Not Recommended for New Design (NRND). No last-time-buy window is specified in the evidence; procurement teams should evaluate long-term supply risk and consider qualifying a replacement if the design is still in early production.

The 208-LQFP package (28x28 mm) is a standard fine-pitch surface-mount footprint. Verify the moisture sensitivity level on the part label before reflow.

Frequently asked questions

What is the exact replacement for LPC2939FBD208?

No official successor order code is listed in the lifecycle record. The LPC2939FBD208,551 is NRND with no direct pin-compatible replacement specified by NXP. For dual-sourcing or long-term supply, evaluate other ARM9 MCUs in the LPC2900 series or consider a migration to a current NXP ARM9 or Cortex-M family part — but no drop-in substitute is documented.

Does LPC2939FBD208 support USB OTG?

Yes, the connectivity list includes USB OTG alongside USB, CAN, I²C, SPI, UART, and LIN.

What is the lifecycle status of LPC2939FBD208?

The lifecycle status is NRND (Not Recommended for New Design).