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NXP USA Inc. LPC2294HBD144/01K — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC2294HBD144/01K ARM7 MCU, 60MHz, 144-LQFP, CANbus, Industrial Temp

MPNLPC2294HBD144/01K
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NXP LPC2200 series ARM7 MCU, LPC2294HBD144/01K, 60MHz core, 256KB FLASH, 16KB RAM, 112 I/O, CANbus, EBI/EMI, I²C, SPI, UART/USART, 8-channel 10-bit ADC, internal oscillator, -40°C to 125°C, 1.65-1.95V, 144-LQFP (20×20mm), surface mount, tray.

$32.5000Ref. price · indicative, final on quote
Packaging144-LQFP
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

LPC2294HBD144/01K Technical Specifications
ParameterValue
SeriesLPC2200
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.65V ~ 1.95V
Operating temperature-40°C ~ 125°C (TA)
Speed60MHz
PackageTray
RAM size16K x 8
Core size16/32-Bit
PeripheralsPOR, PWM, WDT
ConnectivityCANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Number of i (O)112
Core processorARM7®
Case144-LQFP
Data convertersA/D 8x10b SAR
Program memory size256KB (256K x 8)

Frequently asked questions

Does the 144-LQFP pinout allow a drop-in replacement without a board respin?

Pin-compatible second sources for this exact 144-LQFP variant are not listed in the current cross-reference record. The EBI/EMI and CAN pin assignments on a 144-pin device differ from smaller-pin variants in the LPC2200 series — any alternate MCU would require a board respin and firmware verification before it can be treated as a BOM-equivalent.

Does the -40°C to 125°C rating cover PLC retrofit panels at elevated ambient?

The upper limit of 125°C is the ambient operating temperature rating — at 85°C ambient the part has 40°C of thermal headroom, which is usable in most sealed cabinet installations. Actual junction temperature depends on the 144-LQFP thermal resistance and the load currents through the I/O — board thermal design, not just the spec limit, determines whether additional forced convection is needed.