NXP LPC2200 series ARM7® MCU, LPC2220FET144/G,55, 75 MHz core, 64 KB RAM, ROMless, 76 I/O, 8×10-bit ADC, 1.65–3.6 V supply, -40°C to 85°C, 144-TFBGA (12×12 mm) tray.
| Parameter | Value |
|---|---|
| Series | LPC2200 |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | ROMless |
| Voltage - supply (Vcc (Vdd)) | 1.65V ~ 3.6V |
| Operating temperature | -40°C ~ 85°C (TA) |
| Speed | 75MHz |
| Package | Tray |
| RAM size | 64K x 8 |
| Core size | 16/32-Bit |
| Peripherals | POR, PWM, WDT |
| Connectivity | EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART |
| Number of i (O) | 76 |
| Core processor | ARM7® |
| Case | 144-TFBGA |
| Data converters | A/D 8x10b |
No through-hole or hand-solderable option exists for this order code. If you are a maker or small-run builder, the BGA pitch and ROMless memory model make this a challenging part to prototype on a breadboard — you will want a pre-built module or a different package variant in the LPC2200 series.
Connectivity includes I²C, SPI, Microwire, SSI, SSP, and UART/USART — enough for most sensor and actuator buses on a control board.
The evidence does not list a direct pin-compatible replacement. Within the LPC2200 family, parts like the LPC2292 or LPC2294 share the ARM7 core and external bus but differ in RAM, ADC channels, and package options — verify the footprint and BOM before substituting.
The ARM7 core runs at 75 MHz, which is the maximum clock frequency for this device.