NXP LPC2200 series ARM7® MCU, LPC2220FBD144,551, 75 MHz core, 64K x 8 SRAM, ROMless, 76 I/O, 1.65V–3.6V supply, 144-LQFP (20x20 mm), -40°C to 85°C industrial temperature, tray.
| Parameter | Value |
|---|---|
| Series | LPC2200 |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | ROMless |
| Voltage - supply (Vcc (Vdd)) | 1.65V ~ 3.6V |
| Operating temperature | -40°C ~ 85°C (TA) |
| Speed | 75MHz |
| Package | Tray |
| RAM size | 64K x 8 |
| Core size | 16/32-Bit |
| Peripherals | POR, PWM, WDT |
| Connectivity | EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART |
| Number of i (O) | 76 |
| Core processor | ARM7® |
| Case | 144-LQFP |
| Data converters | A/D 8x10b |
Zero on-chip program memory requires an external flash device on the BOM. Firmware updates are handled at the external flash level.
NXP has classified this part as NRND. It is available for existing production BOMs but not for new designs. No official successor order code is listed.
NXP has designated the LPC2220FBD144,551 as NRND (Not Recommended for New Designs). It is not fully discontinued but is not intended for new project starts.
No official direct replacement order code is listed in the available records. For existing BOMs, the part is sourced through independent distribution; for new designs, a pin-compatible ARM7 or Cortex-M3 MCU from the LPC family would be the practical migration path, though no drop-in substitute is documented.
Yes, the LPC2220FBD144,551 is ROMless — it has no on-chip program memory, so an external flash or ROM device must be added to the BOM for code storage.