The LPC2132FHN64,557: Rated for -40°C to 85°C ambient, this MCU handles factory-floor heat and outdoor telecom cabinet swings without derating the core clock. The 64-HVQFN (9x9 mm) exposed-pad package pulls heat into the ground plane — mount it with a thermal via array under the pad if the design pushes the I/O bank near the 47-line limit.
Peripherals and data converters
The 8-channel 10-bit ADC and single 10-bit DAC cover analog front-end tasks like current-sense feedback or set-point generation.
