LPC18S57JET256E

NXP USA Inc.

NXP LPC18xx series 32-bit ARM Cortex-M3 MCU, LPC18S57JET256E, 180MHz core, 1MB Flash, 136K x 8 RAM, 164 I/O, CAN/Ethernet/USB, -40 to 105°C, 256-LBGA.

NXP USA Inc. LPC18S57JET256E
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Technical specifications

LPC18S57JET256E specifications
Parameter / AttributeSpecification / Value
SeriesLPC18xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.2V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed180MHz
PackageTray
RAM size136K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Number of i (O)164
Core processorARM® Cortex®-M3
Case256-LBGA
Data convertersA/D 8x10b; D/A 1x10b
Program memory size1MB (1M x 8)

Technical details

The NXP LPC18S57JET256E is a 32-bit ARM Cortex-M3 microcontroller running at 180 MHz, with 1 MB of on-chip Flash and 136K x 8 of SRAM. That core speed puts it in the upper tier of Cortex-M3 parts — enough headroom to run a real-time control loop alongside a TCP/IP stack without stalling the scheduler. The 1 MB Flash can hold a full application plus a fallback bootloader for field updates; the 136 KB RAM supports moderate buffering for Ethernet frames or CAN message queues. The 164 general-purpose I/O lines, combined with the internal oscillator and brown-out detection, reduce external component count in a motor-drive or PLC I/O module.

Rated for -40°C to 105°C ambient, the LPC18S57JET256E operates from a 2.2 V to 3.6 V supply range. The 256-LBGA package (17x17 mm) requires careful PCB layout for BGA routing.

LPC18S57JET256E
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