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NXP USA Inc. LPC18S30FET256551 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC18S30FET256551 ARM Cortex-M3 MCU, 180MHz, 256-LBGA

MPNLPC18S30FET256551
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NXP LPC18xx series 32-bit ARM Cortex-M3 MCU, LPC18S30FET256551, 180MHz core, 200K x 8 SRAM, ROMless, 164 I/O, 2.2V~3.6V supply, -40°C~85°C, 256-LBGA (17x17) package.

Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LPC18S30FET256551 specifications
ParameterValue
SeriesLPC18xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeROMless
Voltage - supply (Vcc (Vdd))2.2V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed180MHz
PackageBulk
RAM size200K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Number of i (O)164
Core processorARM® Cortex®-M3
Case256-LBGA
Data convertersA/D 8x10b; D/A 1x10b

Product details

180 MHz Cortex-M3 with external boot — what this means for the BOM

The NXP LPC18S30FET256551 is a 32-bit ARM Cortex-M3 MCU running at 180 MHz, with 200K x 8 of on-chip SRAM and no internal program memory — it is ROMless, so the firmware lives on an external SPI Flash or parallel NOR via the EBI/EMI interface. That 180 MHz core clock gives it the throughput to handle real-time control loops, protocol stacks, and data movement without a separate co-processor, but the ROMless architecture means the BOM must include a boot memory device and the PCB must route the external memory bus.

Sourcing posture

The active lifecycle means the factory is still building these, so lead times are typically tied to NXP's standard production cycle rather than a shrinking surplus pool. For a BOM freeze or a line-down replacement, this is a part you can order without worrying about a sudden EOL notice.

Frequently asked questions

What is LPC18S30FET256551's core architecture and speed?

It is a 32-bit ARM Cortex-M3 single-core MCU running at 180 MHz, with 200K x 8 of on-chip SRAM.

What is the package and temperature range for LPC18S30FET256551?

The part comes in a 256-LBGA (17x17 mm) package and is rated for industrial temperature from -40°C to 85°C.

Where can I buy LPC18S30FET256551?

The LPC18S30FET256551 is available to order through independent distribution; submit an RFQ for current pricing and availability confirmation.