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NXP USA Inc. LPC18S10FET100E — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC18S10FET100E ARM Cortex-M3 MCU, 180 MHz, ROMless

MPNLPC18S10FET100E
Active

NXP LPC18S10FET100E, LPC18xx series, 32-bit ARM Cortex-M3 MCU, 180 MHz, 136K x 8 RAM, ROMless, 49 I/O, CAN, EBI, SPI, MMC/SD, 4x10-bit ADC, 1x10-bit DAC, 2.2-3.6V, -40 to 85°C, 100-TFBGA (9x9 mm), tray.

$13.3900Ref. price · indicative, final on quote
Packaging100-TFBGA
RoHSROHS3 Compliant
SeriesLPC18xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LPC18S10FET100E specifications
ParameterValue
SeriesLPC18xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeROMless
Voltage - supply (Vcc (Vdd))2.2V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed180MHz
PackageTray
RAM size136K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, WDT
ConnectivityCANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Number of i (O)49
Core processorARM® Cortex®-M3
Case100-TFBGA
Data convertersA/D 4x10b; D/A 1x10b

Product details

180 MHz Cortex-M3 — no on-chip Flash

The NXP LPC18S10FET100E is a 32-bit ARM Cortex-M3 MCU clocked at 180 MHz, with 136K x 8 of SRAM and no internal program memory — it is ROMless, so all code must run from external Flash or RAM via the EBI/EMI interface. That makes it a fit for designs where you already have a parallel NOR or NAND Flash on the board and want to avoid duplicating memory. The 180 MHz core gives you headroom for protocol stacks (Ethernet, CAN) or real-time control loops without pushing the bus to its limit.

Connectivity and I/O for industrial control

This MCU packs CANbus, I²C, SPI, SSI, SSP, UART/USART, IrDA, Microwire, and MMC/SD interfaces — enough to talk to drives, sensors, and HMI panels over a mix of serial and memory-mapped buses. The 49 general-purpose I/O lines in a 100-TFBGA package (9x9 mm) keep the board footprint tight for space-constrained control modules.

Industrial temperature range, active production

The part is Active in production — no end-of-life notice, no last-time-buy scramble.

Because the LPC18S10FET100E has no internal Flash, the bootloader must reside in external memory — typically a serial NOR Flash or parallel EEPROM on the EBI bus. That adds a memory IC to the BOM but gives you flexibility to change firmware without scrapping the MCU. For field-service swaps, keep a pre-programmed external Flash chip in the kit alongside the MCU; the 100-TFBGA package needs a hot-air station, not a soldering iron, so plan for a rework-capable bench.

Frequently asked questions

Is LPC18S10FET100E ROMless?

Yes, the LPC18S10FET100E has no internal program memory — it is ROMless, so all code executes from external Flash or RAM via the EBI/EMI interface.

What package does LPC18S10FET100E use?

It comes in a 100-TFBGA package measuring 9x9 mm, surface-mount only.

Does LPC18S10FET100E support CAN bus?

Yes, the connectivity set includes CANbus alongside I²C, SPI, UART/USART, and MMC/SD.

What is LPC18S10FET100E's listed speed?

The core runs at 180 MHz, giving it solid headroom for real-time control and protocol processing.