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NXP USA Inc. LPC1810FET100,551 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC1810FET100,551 ARM Cortex-M3 MCU, 150 MHz, 100-TFBGA

MPNLPC1810FET100,551
Active

NXP LPC18xx series LPC1810FET100,551, 32-bit ARM Cortex-M3 MCU, 150 MHz, 136K x 8 RAM, ROMless, 64 I/O, CAN, EBI/EMI, I²C, SPI, UART, 100-TFBGA (9x9 mm), -40 to 85°C.

$7.3980Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
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Specifications

LPC1810FET100,551 Technical Specifications
ParameterValue
SeriesLPC18xx
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeROMless
Voltage - supply (Vcc (Vdd))2V ~ 3.6V
Operating temperature-40°C ~ 85°C
Speed150MHz
PackageTray
RAM size136K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Number of i (O)64
Core processorARM® Cortex®-M3
Case100-TFBGA
Data convertersA/D 12x10b; D/A 1x10b

Product details

What this part is and where it lands

The NXP LPC1810FET100,551 is a 32-bit ARM Cortex-M3 microcontroller from the LPC18xx series, clocked at 150 MHz. It carries 136K x 8 of on-chip RAM but is ROMless — program code must reside in external Flash or ROM accessed via the EBI/EMI or serial interfaces. With 64 GPIOs and a peripheral set that includes CAN, I²C, SPI, UART, and motor-control PWM, this part targets industrial control, motor-drive, and communications gateway applications that need a mid-range Cortex-M3 with flexible external memory and fieldbus connectivity. Operating from 2 V to 3.6 V over -40°C to 85°C, it fits industrial and outdoor telecom enclosures without active cooling.

150 MHz Cortex-M3 — what it means for the control loop

The 150 MHz core delivers single-cycle multiply and a 3-stage pipeline, which handles a typical field-oriented motor-control loop or a CAN gateway stack without saturating the CPU. The ROMless architecture means the designer chooses the external boot device — serial NOR Flash for small-footprint code or parallel Flash/SRAM via the EBI for larger firmware images. The 136K x 8 RAM is enough for two CAN message buffers, a modest RTOS heap, and a few KB of stack; anything beyond that pushes the application into external memory.

Connectivity and peripherals for industrial comms

The LPC1810FET100,551 integrates CAN, EBI/EMI, I²C, SPI, Microwire, SSI, SSP, and UART/USART — enough to bridge a CAN fieldbus to a UART debug port or drive a parallel LCD via the EBI. The motor-control PWM and quadrature encoder interface (via the I²S and PWM blocks) suit it for servo and BLDC drive stages. Brown-out detect, POR, and a watchdog timer are on-chip, reducing external supervisor IC count. The 100-TFBGA (9x9 mm) package saves board area but requires BGA reflow and X-ray inspection — not a hand-solder part.

Lifecycle and sourcing posture

The LPC1810FET100,551 carries an Active lifecycle status. This part is sourced and quoted to order against an RFQ through independent distribution; availability and current pricing are confirmed at quote time. No official second source or direct successor is listed in the evidence, so BOM planners should treat it as a sole-sourced line on the LPC18xx platform.

Frequently asked questions

What is the speed and core of LPC1810FET100?

The LPC1810FET100,551 runs an ARM Cortex-M3 core at 150 MHz.

What is the package type of LPC1810FET100?

The device comes in a 100-TFBGA package with a 9x9 mm body.