Skip to main content
Log in
NXP USA Inc. LPC1768FET100Z — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC1768FET100Z ARM Cortex-M3 MCU, 100 MHz, 512 KB Flash

MPNLPC1768FET100Z
Obsolete

NXP LPC17xx series ARM Cortex-M3 microcontroller, LPC1768FET100Z, 100 MHz, 512 KB Flash, 64 KB RAM, 70 GPIO, Ethernet MAC + CAN + USB OTG, 100-TFBGA (9x9 mm), -40 to 85 °C, 2.4–3.6 V supply, tray packaging.

$11.5658Ref. price · indicative, final on quote
NXP USA Inc. LPC1768FET100Z datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LPC1768FET100Z specifications
ParameterValue
SeriesLPC17xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.4V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed100MHz
PackageTray
RAM size64K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
ConnectivityCANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Number of i (O)70
Core processorARM® Cortex®-M3
Case100-TFBGA
Data convertersA/D 8x12b; D/A 1x10b
Program memory size512KB (512K x 8)

Product details

The NXP LPC1768FET100Z is a 32-bit ARM Cortex-M3 microcontroller from the LPC17xx series, clocked at 100 MHz with 512 KB of Flash and 64 KB of RAM. It integrates an Ethernet MAC, a CAN controller, and USB OTG, making it a fit for industrial gateways, motor-control nodes, and multi-protocol communication modules that need a single-chip network interface. The 70 GPIO pins and peripheral set — including I²S, PWM, and multiple serial interfaces — cover most mid-complexity control and data-acquisition tasks without external glue logic.

512 KB Flash / 64 KB RAM — firmware and buffer sizing

512 KB of Flash holds a full TCP/IP stack, a CANopen or Modbus application layer, and a modest bootloader with room left for field-upgrade images. The 64 KB SRAM is split across the main memory and a separate USB or Ethernet buffer region; a design that streams audio or logs data will need to budget the RAM allocation between stack, heap, and DMA descriptors.

100-TFBGA (9x9 mm) — board-level implications

The 100-ball TFBGA with a 9x9 mm body requires a multi-layer PCB with microvias or via-in-pad for fan-out.

Industrial temperature range — -40 to 85 °C

NXP has marked the LPC1768FET100Z as obsolete.

Frequently asked questions

What is the equivalent of LPC1768FET100Z?

No official direct replacement is listed. The LPC1768FBD100 is the same die in an LQFP-100 package, but the footprint differs. A BGA-to-BGA alternative may exist in the LPC177x or LPC178x series — verify the ball map and peripheral compatibility before substituting.

What package is LPC1768FET100Z?

It is supplied in a 100-ball TFBGA (Thin Fine-Pitch Ball Grid Array) with a 9x9 mm body.

What is the speed of LPC1768FET100Z?

The core runs at 100 MHz.

Where can I buy LPC1768FET100Z?

This obsolete part is sourced through independent distribution. Submit an RFQ for current availability and pricing — stock and lead time are confirmed at quote time, not listed on the page.