The 16 KB Flash and 4 KB RAM suit a bootloader plus one application image. The 2 KB EEPROM stores calibration constants without an external part.
Package reality — WLCSP handling
The 20-WLCSP (2.55 x 2.55 mm) is a wafer-level chip-scale package with solder balls on the underside. It saves board area — about the size of a grain of rice — but it is not a hand-solder part. You need a stencil, a reflow oven, and X-ray inspection to verify the joints. For field swaps, plan on hot-air rework or a pre-programmed spare on a carrier board. The upside: the small footprint lets you pack this MCU into a sensor housing or a dongle where a QFN would not fit.
