NXP LPC1100XL series 32-bit ARM Cortex-M0 MCU, LPC1115JET48/303QL, 50 MHz, 64 KB Flash, 8 KB RAM, 42 I/O, 1.8-3.6 V, -40 to 105°C, 48-TFBGA (4.5x4.5 mm).
| Parameter | Value |
|---|---|
| Series | LPC1100XL |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C ~ 105°C (TA) |
| Speed | 50MHz |
| Package | Tray |
| RAM size | 8K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, POR, WDT |
| Connectivity | I²C, SPI, UART/USART |
| Number of i (O) | 42 |
| Core processor | ARM® Cortex®-M0 |
| Case | 48-TFBGA |
| Data converters | A/D 8x10b |
| Program memory size | 64KB (64K x 8) |
Housed in a 48-ball TFBGA measuring 4.5 mm square, this is a fine-pitch BGA. It saves board area over a TQFP but demands controlled reflow profiling and X-ray inspection for solder-joint verification. Not a hand-solder part; plan for a stencil and pick-and-place if you are prototyping.
Listed as Active with no end-of-life notice.
This part is available to order against an RFQ. Availability and current pricing are confirmed at quote time through our sourcing desk.
The rated operating temperature range is -40°C to 105°C ambient, making it suitable for industrial and automotive cabin environments.
It comes in a 48-ball TFBGA (4.5x4.5 mm) — a fine-pitch BGA requiring reflow soldering and X-ray inspection.
Pin-compatible alternatives exist within the LPC1100XL series — for example, the LPC1114JET48/303QL offers the same package and pinout with 32 KB Flash. Verify the exact memory and peripheral set against your firmware size before substituting.