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NXP USA Inc. LPC1114FDH28/102:5 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC1114FDH28/102:5 ARM Cortex-M0 MCU, 50MHz, 32KB Flash, 28-TSSOP

MPNLPC1114FDH28/102:5
Active

NXP LPC1100L series ARM Cortex-M0 MCU, 50MHz, 32KB flash, 4KB RAM, 22 GPIOs, 6x10b ADC, I2C/SPI/UART, 1.8-3.6V supply, -40 to 85°C, 28-TSSOP Cut Tape (CT) and Tape & Reel (TR).

$3.6400Ref. price · indicative, final on quote
Packaging28-TSSOP (0.173", 4.40mm Width)
RoHSROHS3 Compliant
SeriesLPC1100L
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LPC1114FDH28/102:5 specifications
ParameterValue
SeriesLPC1100L
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed50MHz
PackageTape & Reel (TR) Cut Tape (CT)
RAM size4K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, POR, WDT
ConnectivityI²C, SPI, UART/USART
Number of i (O)22
Core processorARM® Cortex®-M0
Case28-TSSOP (0.173\", 4.40mm Width)
Data convertersA/D 6x10b
Program memory size32KB (32K x 8)

Frequently asked questions

The peer LPC1112FDH20/102:5 has 18 I/O versus 22 on the LPC1114FDH28/102:5 — can the same 32KB flash and 4KB RAM firmware be ported without recompile?

The flash and RAM sizes are identical, and the ARM Cortex-M0 core and CMSIS peripheral map are broadly compatible within the LPC1100 family. However, the four-GPIO shortfall means any firmware binary that maps signals to those specific pins will not reproduce those functions on the LPC1112 without a recompile and pin reassignment. If the firmware is pin-agnostic or those four extra pins are unused, a re-flash of the same compiled image may work — but confirm the:5 stepping alignment in the build configuration before committing.

We need 50 units for a Q4 panel build and have had EOL PCNs on prior LPC1100 tape reels — what is the sourcing posture on this part?

Active status supports a 50-unit BOM commitment without an immediate supply cliff. The Cut Tape (CT) and Tape & Reel (TR) packaging options are both listed, which allows flexibility for prototype versus production ordering. Lead time and minimum order quantity should be confirmed against current stock availability through your distributor desk — open-market purchases of LPC1100 series TSSOP parts carry a documented risk of pulls or remarked parts, and the current MCU sourcing environment has elevated allocation sensitivity on older NXP TSSOP reels.