Active production — sourcing posture
The LPC1112LVFHI33/103551 carries an Active product status. There is no last-time-buy notice or end-of-life window on record. For a BOM freeze, this part is a low-risk line item — no imminent PCN-driven respin. Sourced and quoted to order against an RFQ through independent distribution; availability and current pricing confirmed at quote time.
32-HVQFN package — board integration
The 32-lead HVQFN with exposed pad (5x5 mm body) is a common footprint for space-constrained designs. The exposed pad must be soldered to a ground-plane land on the PCB for thermal and electrical contact — a via-in-pad or at least a thermal via array under the pad is standard practice. The 27 GPIOs break out on three sides; check the pinout against the LPC1112 base number to confirm peripheral mapping for your I²C or SPI bus assignment.