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NXP USA Inc. LPC1112JHN33/203551 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC1112JHN33/203551 ARM Cortex-M0 MCU, 50 MHz

MPNLPC1112JHN33/203551
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NXP LPC1100XL series 32-bit ARM Cortex-M0 MCU, LPC1112JHN33/203551, 50 MHz, 16 KB Flash, 4 KB RAM, 28 I/O, I²C/SPI/UART, 8x10-bit ADC, -40°C to 105°C, 32-HVQFN (7x7).

Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LPC1112JHN33/203551 specifications
ParameterValue
SeriesLPC1100XL
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed50MHz
PackageBulk
RAM size4K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, POR, WDT
ConnectivityI²C, SPI, UART/USART
Number of i (O)28
Core processorARM® Cortex®-M0
Case32-VQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size16KB (16K x 8)

Product details

50 MHz Cortex-M0 — what the clock buys you

50 MHz is the ceiling for this core. At that speed a tight polling loop or a simple PID filter runs comfortably, and the SPI/I²C/UART interfaces can keep up with typical sensor and display traffic. The 32-bit single-cycle multiply helps with integer math; you are not going to run an FFT on this chip, but for a brushless-DC commutation algorithm or a Modbus RTU slave it has the cycles.

Memory budget — 16 KB Flash, 4 KB RAM

16 KB of Flash and 4 KB of SRAM are the memory limits. The 4 KB SRAM is the tighter constraint — watch stack depth and buffer allocations.

Package and supply

The part comes in a 32-lead HVQFN with an exposed pad (7x7 mm).

Frequently asked questions

What is LPC1112JHN33/203551's core speed?

The core runs at 50 MHz, which is the maximum clock for this ARM Cortex-M0 device. That speed handles typical sensor polling, UART communication, and simple control loops.

What is the operating temperature range for LPC1112JHN33/203551?

It is rated for -40°C to 105°C, which qualifies it for industrial environments like motor drives, outdoor telecom, and under-hood automotive modules.