74HC1G14GW,125
Nexperia USA Inc.
74HCTape & Reel (TR); Cut Tape (CT)-40°C ~ 125°C
Ref. price$0.39
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Nexperia USA Inc. 74HC Isolators Series
4 variants · Nexperia USA Inc.
About the Nexperia USA Inc. 74HC Isolators Series
The Nexperia USA Inc. 74HC Isolators Series series groups 4 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. Every variant in the range shares a common mounting of Surface Mount and package of Tape & Reel (TR); Cut Tape (CT). Variants differ by case, current - output high, low and logic type, so you can match the exact case your application requires using the selection guide below. All listed Nexperia USA Inc. 74HC Isolators Series part numbers are active and orderable.
Select a variant by
- Case
- 5-TSSOP, SC-70-5, SOT-353 · 14-SOIC (0.154\", 3.90mm Width) · 14-TSSOP (0.173\", 4.40mm Width) · SC-74, SOT-457
- Current - output high, low
- 2.6mA, 2.6mA · 4mA, 4mA
- Logic type
- AND Gate · Buffer, Non-Inverting · Inverter · NAND Gate
- Operating temperature
- -40°C ~ 125°C · -40°C ~ 125°C (TA)
- Voltage
- 2V ~ 6V · 4.5V ~ 5.5V
- Current - quiescent
- 2 µA · 20 µA
- I/O channels
- 1 · 2 · 3
Shared specifications
- Mounting
- Surface Mount
- Package
- Tape & Reel (TR); Cut Tape (CT)
Variant comparison
| Parameter | 74HC1G14GW,125 | 74HCT11PW,118 | 74HCT132D,653 | 74HCT2G16GVH |
|---|---|---|---|---|
| Case | 5-TSSOP, SC-70-5, SOT-353 | 14-TSSOP (0.173\", 4.40mm Width) | 14-SOIC (0.154\", 3.90mm Width) | SC-74, SOT-457 |
| Current - output high, low | 2.6mA, 2.6mA | 4mA, 4mA | 4mA, 4mA | 4mA, 4mA |
| Logic type | Inverter | AND Gate | NAND Gate | Buffer, Non-Inverting |
| Operating temperature | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C (TA) |
| Voltage | 2V ~ 6V | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V |
| Current - quiescent | 20 µA | 2 µA | 2 µA | — |
| I/O channels | 1 | 3 | 2 | — |
Request a quote on any Nexperia USA Inc. 74HC Isolators Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.
