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Microchip Technology 1N5822US — Discrete Semiconductors

Microchip 1N5822US Schottky Diode, 40V 3A, SQ-MELF

MPN1N5822US
Active

Microchip Technology 1N5822US Schottky diode, 40 V reverse, 3 A forward, 500 mV Vf, SQ-MELF B package, surface mount, fast recovery < 500 ns.

$77.8600Ref. price · indicative, final on quote
PackagingSQ-MELF, B
RoHSRoHS non-compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

1N5822US specifications
ParameterValue
Diode typeSchottky
MountingSurface Mount
Voltage - DC reverse (Vr)40 V
Voltage - forward (Vf) (Max) @ if500 mV @ 3 A
Current - reverse leakage @ vr100 µA @ 40 V
Current - average rectified3A
Operating temperature - junction-65°C~125°C
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageBulk
CaseSQ-MELF, B

Product details

Schottky rectifier — 40 V, 3 A, hermetic barrel

The 1N5822US is a 40 V, 3 A Schottky rectifier in a hermetic SQ-MELF (B) package from Microchip Technology. Its 500 mV forward drop at 3 A keeps conduction losses low in power rectification, freewheeling, and OR-ing stages. The junction temperature range spans -65 to 125 °C — a military-grade temperature window that suits avionics power supplies, downhole instrumentation, or outdoor telecom rectifier stages where commercial parts would derate or fail.

Switching speed and leakage — what the ratings mean

Listed with a fast recovery spec of < 500 ns at > 200 mA — unusual for a Schottky, which is already a majority-carrier device. This suggests the part is characterized for higher-frequency rectification (e.g., 100 kHz+ switching supplies) where stored charge in a standard Schottky could still cause ringing. Reverse leakage is 100 µA at the full 40 V rating. Leakage in a Schottky doubles roughly every 10 °C; at 125 °C junction, expect leakage in the milliampere range — factor that into standby power budgets for hot environments.

SQ-MELF (B) is a hermetic ceramic barrel with metallized end caps — no plastic body, no moisture sensitivity. It survives high-humidity or vacuum environments where a standard SMC package would absorb moisture and pop during reflow. Surface-mount, but the barrel shape requires careful solder-paste stencil design: the end-cap terminations need enough paste volume to form a fillet without bridging to the body. The package footprint is non-standard — confirm the land pattern against the manufacturer's recommended pad layout before committing the PCB.

Lifecycle and compliance

RoHS non-compliant. The hermetic construction typically uses lead-bearing solder in the end-cap termination. For EU or RoHS-enforced builds, an exemption (e.g., RoHS Annex III exemption 7a for high-melting-temperature solder) may be required — verify with your compliance team before specifying.