ISSI, Integrated Silicon Solution Inc IS66WVQ8M4DBLL-133BLI — Crystals & Oscillators
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RoHS Compliant · Lead-Free EIA-481 Standard

IS66WVQ8M4DBLL-133BLI — ISSI 32Mbit PSRAM, 133MHz Quad SPI

MPN IS66WVQ8M4DBLL-133BLI
Active Spot Stock · 24-48h Dispatch 100% Original Sealed

ISSI Integrated Silicon Solution Inc, PSRAM, 32Mbit, 133MHz, SPI Quad I/O, 8M x 4 organization, 2.7V to 3.6V, -40°C to 85°C, 24-TFBGA (6x8), Surface Mount, Tray.

In Stock: 337 pcs
MOQ: 1 pcs
Logistics: DHL / FedEx DAP (Global Express · 3-7d) Russia & CIS DDP (Door-to-Door Cleared)
Dispatch: Shenzhen / HK
Unit Price (USD)
$3.57 / pc
Direct Purchase Ready
Volume Pricing Breaks Confirmed upon quotation
1+ pcs
$3.57
10+ pcs
$3.21
30+ pcs
$2.93
100+ pcs
$2.64
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$3.57 / ea

337 in stock — maximum per order · 3–4 days lead time

$3.21 / ea from 10 pcs

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[SPEC] Essential Parameters Snapshot Full Specifications (13)
Package / Case 24-TBGA
Supply Voltage 2.7V ~ 3.6V
Speed / Frequency 133 MHz
Memory / RAM 32Mbit

Full Technical Specifications

13 Parameters
IS66WVQ8M4DBLL-133BLI specifications
Parameter / AttributeSpecification / Value
Memory typeVolatile
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Clock frequency133 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologyPSRAM (Pseudo SRAM)
Memory size32Mbit
Memory formatPSRAM
Case24-TBGA
Memory organization8M x 4
Write cycle time - word, page45ns
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[01] Emergency Shortage 24-48h Shenzhen Dispatch

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[02] Industrial Packaging Tape & Reel / Tray / Tube

Standard factory-sealed packaging compliant with EIA-481 standards for automated high-speed SMT pick-and-place lines.

[03] WhatsApp QC Proof 45x Microscope QC Photos

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Technical Details & Description

32Mbit pseudo-SRAM at 133 MHz Quad SPI

The IS66WVQ8M4DBLL-133BLI is a volatile pseudo-SRAM organized 8M x 4, clocked at 133 MHz over a Quad I/O SPI interface. At that speed the 45 ns write-cycle time is the limiting factor for burst-write throughput — the Quad I/O bus delivers four bits per SCK edge, but the memory array itself needs that 45 ns per word or page write before the next operation can begin.

24-TFBGA footprint and board integration

The supplier device package is a 24-TFBGA (6x8 mm) with surface-mount tray packing. BGA rework is sensitive to the paste-print and reflow profile — the 45 ns write cycle is a memory-array spec, not a thermal constraint, but the reball process for this pitch requires a hot-air or IR rework station capable of uniform preheat across the 6×8 mm die area to avoid package crack on thermal cycling. Because the memory is volatile, there is no non-volatile storage content to preserve during a power-off cycle — the bring-up checklist does not need to account for data-retention state, which simplifies the boot sequence compared to flash or EEPROM-backed designs.

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