Power Semiconductors: Two Rounds of Hikes in 2026, and MOSFET/IGBT Lead Times Now Run 35–40 Weeks

Who raised what, when — and how to buy power devices when 8-inch capacity is shrinking

By Procurement Priya · icboms supply-chain desk · data through August 11, 2026

Power semiconductors were the quiet category for most of 2025. That changed this year. Roughly twenty vendors — Infineon, onsemi, Silan, CR Micro, Yangjie, NCE Power, and a dozen more — have now issued two rounds of increases, most effective February–May and then July 1. MOSFETs tightened first, then IGBTs. Lead times at the integrated-device manufacturers are running 35–40 weeks, and SiC/GaN past 30.

The mechanism is the same one driving analog: 8-inch mature-node wafer capacity is contracting while AI datacenters and 800V/1000V EV platforms consume more power devices per unit than anyone budgeted. A single AI server carries 5–8x the power devices of a conventional server. Infineon's FY2027 AI-datacenter revenue target is EUR 2.5 billion, and its automotive orders are booked into 2027.

This report lays out the two rounds in sequence, the lead times that matter, and a sourcing plan that treats power devices as a 12-month commitment rather than a quarterly purchase.

1. Round one (February–May): domestic vendors moved first

• CR Micro — February 1, full microelectronics line +10% minimum.
• JieJie Micro — MOSFET +10–20% effective February 1; thyristors up modestly.
• NCE Power — MOSFET +10%+ effective March 1 (letter dated February 25), citing precious-metal and foundry/OSAT costs.
• Macro Micro — IGBT single-tube/module and MOSFET ~+10% effective March 1 (letter February 24); low-end IGBT about +10%.
• Silan Micro — full line +10% effective March 1.
• Yangjie — first round within this window, then a second (below).
• onsemi — first round ~+10% in March–April; automotive image sensors and power devices +15–22% from June 20.

The pattern in round one: domestic vendors went first, on cost. Precious metals, foundry, and OSAT cost increases hit the mature-node power business before demand became the story.

2. Round two (July 1): the industry moved together

• Infineon — second round effective July 1, +10–20% on AI power ICs, automotive IGBT, and high-voltage MOSFET; SiC modules and other high-end categories over +15%. (First round effective April 1.)
• Silan Micro — full line +15%+ effective July 1 (year's second round), citing wafer foundry and assembly/test costs beyond what it can absorb.
• Yangjie — full series +10–15% effective July 1 (letter June 17).
• CR Micro — second round +15% minimum effective July 1, with order visibility out to 9 months.
• onsemi — second broad round on discrete and power lines (including IGBT, MOSFET) from July 11.
• BASiC (pure-SiC) — announced July 13 that selected products rise up to +25% from Q3. This is a pure SiC MOSFET/diode/automotive-module player, and the +25% cap is the highest in this round.

Two things stand out in round two. First, the increase is industry-wide and simultaneous — that is the signature of a capacity shortage, not a cost pass-through. Second, the highest increases sit on SiC and high-voltage automotive parts, which are exactly the categories with the longest qualification cycles and the least elastic supply.

3. Lead times: the binding number

• IDM MOSFET/IGBT: 35–40 weeks (8–9 months).
• SiC/GaN: over 30 weeks.
• Low-voltage MOSFET: 12–52 weeks depending on package and grade.
• Server PMIC: stretched from 21–26 to 35–40 weeks (TrendForce).

On the input side, 8-inch foundry utilization has climbed from 75–80% to 85–90% in 2026 (TrendForce), foundry pricing is up 5–20%, and OSAT up close to 30%. China Securities expects the power-semiconductor supply-demand tightness to persist 6–12 months, with price increases continuing into 2027. The 8-inch capacity contraction itself runs through at least H1 2027 — TSMC and Samsung have both been reducing it.

4. What is driving demand

• AI datacenters: a single AI server uses 5–8x the power devices of a normal server. TI's datacenter business grew about 90% YoY in Q1. Server power-management content is the fastest-growing bucket.
• 800V/1000V EV platforms: high-voltage platforms pull IGBT and SiC content per vehicle, and the automotive backlog is already booked well into 2027.
• HVDC architectures: datacenter power delivery moving to higher-voltage DC raises high-voltage MOSFET and module content.

None of these are cyclical dips. They are structural demand changes landing on a shrinking capacity base.

5. How to buy power devices in this market

1. Pre-book high-voltage MOSFET, automotive IGBT, and SiC 8–12 months out. At 35–40 week lead times, an order placed today lands around Q1 2027. Low-voltage MOSFETs can still be bought on a spot basis.
2. Price spot premiums into your model. IGBT discretes and modules carry 10–25% spot premiums; automotive high-voltage MOSFET and SiC run 30–50% above contract. If you are bridging on spot, budget for it rather than discovering it at invoice time.
3. Use the domestic SiC price gap. Imported SiC MOSFETs run about 1.8x the price of domestic equivalents; after this round of hikes the gap has widened to roughly 2.2x. For cost-down programs on non-safety-critical rails, domestic SiC is the fastest lever.
4. Track the letter batches, not the rumor. Effective dates cluster at 4/1, 5/1, and 7/1. Expect at least one or two more rounds this year. Before issuing a PO, confirm the effective date of the price you were quoted — a "locked" price from before July 1 is usually not locked.
5. Tier your planning by category. Server PMIC and other general parts went 21–26 → 35–40 weeks; lock those first. Automotive and high-end parts are being allocated toward AI-datacenter customers, so their lead times will keep drifting — treat them as the longest-lead items in your BOM.

6. Data notes

Data cutoff is August 11, 2026. Figures are as reported by TrendForce, ESMChina, Securities Times, Caixin, CLS, and vendor price letters as covered in Chinese and English industry media. Price and lead-time data on power semiconductors varies by channel and grade; treat as directional planning data, not quotes. Confirm effective dates and delivery with your supplier before committing.

icboms (icboms.com) is a Shenzhen-based independent distributor covering power semiconductors, analog, MCU, memory, and passives. For availability and same-day quotes on MOSFET, IGBT, SiC, and power-management parts — Infineon, onsemi, domestic SiC — use the RFQ workflow on the product pages or contact the sourcing desk.