WLP package and board-level integration
The MAX98303EWE+T is supplied in a 16-WLP (Wafer-Level Package) — essentially the die itself with solder bumps, no plastic overmold. The 16-WFBGA, WLBGA package footprint matches the 16-WLP supplier device package; the 0.4 mm ball pitch demands a controlled solder-paste stencil and a reflow profile tuned for wafer-level bumps. Moisture sensitivity is inherently low for WLP (no mold compound to absorb moisture), but the bare-silicon backside is exposed — handle with ESD precautions and avoid mechanical contact with the die surface.
Output power and supply headroom
Rated 3.1 W per channel into a 4 Ω load (stereo, 2-channel output). That figure is achievable with a 5 V supply; drop the rail to 2.6 V and the available output power drops proportionally. The Class D architecture keeps efficiency above 85 % at moderate power levels, minimising heat in the WLP package.
Protection and audio features
Built-in depop circuitry eliminates the turn-on/turn-off thump that otherwise couples through the speaker. Differential inputs reject common-mode noise picked up on the audio traces between codec and amplifier. Short-circuit and thermal protection shut down the output stage before the die exceeds its safe operating area; the shutdown pin lets a host controller force the amplifier into a low-current state when audio is not needed.