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Analog Devices MAX9275GTN/V+ — DC-DC Power Modules

MAX9275GTN/V+ Serializer, 3.12Gbps, 56-TQFN, Active

MPNMAX9275GTN/V+
End of Life

Analog Devices GMSL serializer, MAX9275GTN/V+, 3.12Gbps data rate, 28 LVCMOS inputs, 1 CML output, 56-TQFN (8x8) exposed pad, tray.

$26.18Ref. price · indicative, final on quote
Packaging56-WFQFN Exposed Pad
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MAX9275GTN/V+ Technical Specifications
ParameterValue
Input typeLVCMOS
Output typeCML
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Number of inputs28
Number of outputs1
Operating temperature-40°C ~ 105°C (TA)
PackageTray
FunctionSerializer
Data rate3.12Gbps
Case56-WFQFN Exposed Pad

Product details

Serializer for GMSL links — what the data rate and I/O tell you

The MAX9275GTN/V+ is a GMSL serializer that takes 28 parallel LVCMOS inputs and serialises them onto a single CML output at up to 3.12 Gbps — the link budget for a 28-bit parallel bus at that rate determines the maximum coax or STP cable length before the receiver's equaliser runs out of gain. Running from a 1.7 V to 1.9 V supply, it is designed for the 1.8 V core rail common in automotive and industrial camera/display modules — the narrow tolerance means the supply needs a local LDO or a clean 1.8 V rail with less than 100 mV ripple. The -40°C to +105°C operating range covers the under-hood and cabin temperature profile for AEC-Q100-qualified parts (the MAX9275GTN/V+ itself is not marked AEC-Q in the recorded data, but the temperature grade matches that expectation).

Package and board integration — 56-TQFN with exposed pad

The 56-TQFN (8x8 mm) exposed-pad package requires a thermal via array under the centre pad to pull heat into the PCB ground plane — the datasheet's recommended footprint uses a 5×5 via pattern with 0.3 mm finished hole diameter, and the pad itself must be soldered to the ground pour to meet the thermal resistance spec. It ships in a tray (the entry), not tape-and-reel — for high-volume pick-and-place, confirm the feeder compatibility or request a reel-pack variant if one exists in the MAX9275 family. Surface-mount assembly with an MSL rating typical of TQFN packages (the recorded data does not list MSL, but the 56-TQFN body is standard for this class — expect MSL 3 and a 168-hour floor life after opening).