Package and thermal — 28-TQFN exposed pad
The 28-TQFN (5x5) package with exposed pad is a compact footprint for space-constrained DDR modules or embedded memory systems. The exposed pad must be soldered to a thermal via array on the PCB to dissipate heat effectively — skipping that stitch will limit continuous output current. The part is rated for surface-mount assembly and is available in Tape & Reel (TR) for production or Cut Tape (CT) for prototyping.
Lifecycle and sourcing
The MAX8632ETI+T is listed as Active in production with ROHS3 compliance.
