Package and thermal: 14-TSSOP exposed pad
Housed in a 14-TSSOP package with an exposed pad (supplier device package 14-TSSOP-EP), this part is intended for surface-mount assembly. The exposed pad must be soldered to a copper land on the PCB and connected to the ground plane to achieve the rated thermal performance. At 2A continuous output, the pad's thermal path is the primary dissipation route — a layout without sufficient via stitching under the pad will limit the usable current before the junction temperature hits the limit. The package body measures 4.40 mm width, typical for TSSOP-14, so the footprint is compact enough for dense power-management sections.
Protection and control features
On-chip protection includes over-temperature shutdown and short-circuit current limiting, so the regulator survives output faults without external clamp diodes. The control interface provides an enable pin and a power-on-reset output, allowing sequencing of downstream loads. The operating temperature range is -40°C to 85°C, covering industrial and outdoor telecom environments.
Sourcing and lifecycle
The MAX8528EUD+ carries an active lifecycle status and is ROHS3 compliant. No official second source or pin-compatible replacement is listed in the manufacturer's cross-reference, so dual-sourcing would require a parametric search for a functionally equivalent LDO in the same package.