Package and mounting for thermal management
Housed in a 24-PowerUFQFN with an exposed pad (3x3 mm), the MAX77751FEFG+ relies on the PCB copper pour and via stitching under the package to dissipate heat from the 3.15A charge pass element. Surface-mount assembly is standard, but the thermal pad must be soldered to a ground plane.
Lifecycle and compliance
The device is ROHS3 compliant, meeting the material restriction directive for solder joints and lead-free assembly.
