Package and footprint
Housed in a 10-lead TFSOP or MSOP with a 3.00 mm body width, the MAX6709CUB takes minimal board area. The supplier device package is designated 10-uMAX. The small footprint suits dense multilayer boards where every square millimetre counts. Surface-mount assembly is standard; no special soldering profile beyond typical lead-free reflow for TFSOP/MSOP packages.
Lifecycle and compliance
Note that the RoHS compliance status is marked non-compliant — this part is not lead-free. For RoHS-required builds, verify whether your assembly process and end-market accept tin-lead plating, or look at the lead-free variant in the same family.
