Internal ADC and register-bank architecture for system integration
The MAX6652AUB+T: The internal ADC, multiplexer, and register bank topology converts the local die temperature into a digital value that the host reads over the I²C/SMBus interface — no external ADC or signal conditioning needed. The output alarm pin provides a hardware interrupt when the temperature crosses a programmed threshold, offloading the host from continuous polling.
Package and board-fit note for the 10-uMAX/uSOP
Housed in a 10-TFSOP / 10-MSOP (3.00 mm width) package, designated as the 10-uMAX/uSOP supplier device package. This is a small-outline footprint suited for space-constrained PCBs in base stations, routers, or industrial controllers where board real estate is at a premium. Supplied in Tape & Reel (TR) and Cut Tape (CT) options — the reel format is standard for pick-and-place assembly; the cut tape is useful for prototyping or low-volume builds.
Compliance and sourcing posture
RoHS3 compliant — no conflict with current environmental regulations across EU, UKCA, or other RoHS-enforcing markets.