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Analog Devices MAX640ESA+ — Discrete Semiconductors

MAX640ESA+ Buck Regulator, 225mA, 8-SOIC

MPNMAX640ESA+
End of Life

Analog Devices MAX640ESA+ step-down buck regulator, 225 mA output, adjustable (1.3V) or fixed 3.3V output, 4V to 11.5V input, 8-SOIC surface-mount package, tube.

$9.57Ref. price · indicative, final on quote
Packaging8-SOIC (0.154", 3.90mm Width)
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MAX640ESA+ Technical Specifications
ParameterValue
Output typeAdjustable (Fixed)
Mounting typeSurface Mount
Voltage - input11.5V
Voltage - output11.5V
Voltage - output (Min (Fixed))1.3V (3.3V)
Current - output225mA
Number of outputs1
Operating temperature-40°C ~ 85°C (TA)
PackageTube
FunctionStep-Down
TopologyBuck
Case8-SOIC (0.154\", 3.90mm Width)
Output configurationPositive
Synchronous rectifierNo

Product details

225 mA buck for point-of-load rails

The MAX640ESA+ is a step-down (buck) switching regulator from Analog Devices, delivering up to 225 mA from a single positive output. It accepts an input rail between 4 V and 11.5 V, making it a fit for 5 V or 9 V intermediate buses common in industrial and telecom boards.

Output voltage options and load fit

The output can be set to an adjustable voltage down to 1.3 V, or configured for a fixed 3.3 V output — the fixed version simplifies the BOM by eliminating the external resistor divider. At 225 mA, this regulator suits light point-of-load rails for MCUs, sensors, or low-power logic that need a clean, regulated supply from a higher bus voltage. It does not include a synchronous rectifier, so the external Schottky diode carries the freewheeling current — budget the diode's forward drop and thermal dissipation in the layout, especially at higher input-to-output differentials.

Package and board integration

Supplied in tube packaging, it is suited for low-to-medium volume assembly or prototyping; for reel quantities, confirm the tube-to-reel conversion with the distributor at RFQ.