Package and mounting
Housed in a 16-TQFN 5x5 mm package, the part is surface-mount only. The exposed pad must be soldered to a thermal land on the PCB for heat dissipation — the 91 W internal switch and DC/DC stage generate heat that the pad pulls into the board copper.
Lifecycle and sourcing
The MAX5995BETE+ carries an Active lifecycle status from Maxim Integrated (now part of Analog Devices). It is ROHS3 compliant. No last-time-buy risk is indicated for this code.
