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Analog Devices MAX5064AATC+ — Analog & Data Acquisition

MAX5064AATC+ Half-Bridge Gate Driver, 2A Peak

MPNMAX5064AATC+
End of Life

Maxim MAX5064AATC+, Half-Bridge Gate Driver, N-Channel MOSFET, 2 Drivers, 8V to 12.6V Supply, 2A Peak Source/Sink, 125V Bootstrap, 65ns Rise/Fall, -40°C to +150°C, 12-WQFN Exposed Pad, Tube.

$5.97Ref. price · indicative, final on quote
Packaging12-WQFN Exposed Pad
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MAX5064AATC+ Technical Specifications
ParameterValue
Gate typeN-Channel MOSFET
Input typeInverting, Non-Inverting
Channel typeIndependent
Mounting typeSurface Mount
Voltage8V ~ 12.6V
High side voltage - max (Bootstrap)125 V
Current - peak output (Source, sink)2A, 2A
Operating temperature-40°C ~ 150°C (TJ)
PackageTube
Case12-WQFN Exposed Pad
Number of drivers2
Driven configurationHalf-Bridge
Rise (Fall time)65ns, 65ns

Product details

Half-bridge driver for N-channel MOSFETs

The Maxim MAX5064AATC+ is a half-bridge gate driver designed to drive two N-channel MOSFETs in an independent-channel configuration. It accepts both inverting and non-inverting input types, giving flexibility in control logic polarity. The driver delivers a peak output current of 2A source and 2A sink, with typical rise and fall times of 65 ns, which keeps switching losses manageable in medium-frequency power stages. The high-side bootstrap supply is rated to 125 V, so the part can handle DC bus voltages up to that level in applications like motor drives, DC-DC converters, and UPS systems. Supply voltage range is 8 V to 12.6 V, a common bias rail for gate-drive ICs. The operating junction temperature spans -40°C to +150°C, qualifying it for automotive under-hood and industrial high-temperature environments.

Package and thermal management

The MAX5064AATC+ comes in a 12-WQFN package with an exposed pad, also designated as a 12-TQFN (4x4 mm) supplier device package. Surface-mount assembly is standard. The exposed pad must be soldered to a thermal land on the PCB and connected to the ground plane through an adequate via array to pull heat away from the junction, especially when driving high gate-charge MOSFETs at elevated switching frequencies. The package ships in Tube form.

Lifecycle and sourcing

The MAX5064AATC+ carries an Active product status and is ROHS3 compliant.

Frequently asked questions

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Is MAX5064AATC+ in stock?

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What is the datasheet for MAX5064AATC+?

Design engineers need datasheet for electrical specifications and timing parameters.

What is the replacement for MAX5064AATC+?

If part becomes obsolete or unavailable, engineers need compatible alternatives for design continuity.

Is MAX5064AATC+ obsolete or EOL?

Maintenance and long-term support depend on lifecycle status to plan for replacements.