Package and footprint — tiny DFN for tight boards
Housed in a 6-WFDFN package with the supplier device package specified as 6-µDFN measuring 1.5x1 mm, this is a very small surface-mount part. The 1.5x1 mm footprint is about the size of a grain of pepper, which helps when board real estate is at a premium — think wearable devices, compact IoT modules, or multi-port USB hubs where every square millimetre counts. The surface-mount package is compatible with standard reflow soldering processes.
Lifecycle and sourcing — active, no end-of-life concern
For a BOM line, that removes the obsolescence risk that drives last-time-buy scrambles. The part is ROHS3 compliant, so it meets the latest EU restriction requirements without a waiver. Sourcing is straightforward through independent distribution: we quote this part to order against an RFQ, confirming availability and current pricing at quote time. There is no single-source exposure — the part is widely available through multiple channels.