Package and mounting
The switch comes in a 10-lead TDFN package with an exposed pad (3x3mm body). The pad must be soldered to a PCB thermal land with vias to a ground plane for rated thermal performance. The part is surface-mount only; no through-hole variant exists. Reel and cut-tape options are available for prototyping or production volume.
Channel matching and capacitance
Channel-to-channel on-resistance matching is 100mOhm maximum, which means the four channels present nearly identical resistance to the signal — useful when gain accuracy or attenuation matching matters across channels. Off-channel capacitance is 13pF on the source side and 52pF on the drain side; this capacitance forms a low-pass filter with source impedance, so the designer should account for it in the bandwidth budget.