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Analog Devices MAX4252EBL+T — Logic ICs

MAX4252EBL+T General Purpose Op-Amp, 3 MHz GBW, 8-UCSP

MPNMAX4252EBL+T
End of Life

Maxim Integrated MAX4252EBL+T, General Purpose Amplifier, 2 Circuits, Rail-to-Rail, 3 MHz GBW, 0.3 V/µs slew rate, 70 µV offset, 2.4 V to 5.5 V supply, 8-UCSP package.

$2.86Ref. price · indicative, final on quote
Packaging8-WFBGA, CSPBGA
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

MAX4252EBL+T Technical Specifications
ParameterValue
Output typePush-Pull, Rail-to-Rail
Mounting typeSurface Mount
Amplifier typeGeneral Purpose
Voltage - input offset70 µV
Voltage - supply span5.5 V
Current - supply420µA (x2 Channels)
Current - input bias0.1 pA
Current - output (Channel)68 mA
Operating temperature-40°C ~ 85°C
Gain bandwidth product3 MHz
PackageTape & Reel (TR); Cut Tape (CT)
Slew rate0.3V/µs
Case8-WFBGA, CSPBGA
Number of circuits2

Product details

3 MHz GBW at 420 µA — the power/speed trade-off that matters

The MAX4252EBL+T is a dual general-purpose op-amp from Maxim Integrated, packing two rail-to-rail output channels into an 8-UCSP (1.6x1.6 mm) package. Its 3 MHz gain-bandwidth product at 420 µA per channel puts it in the sweet spot for low-frequency signal conditioning where you need bandwidth without burning the battery budget. The 70 µV input offset and 0.1 pA bias current mean you don't lose DC accuracy to the front end, even with high-impedance sensors.

Slew rate and output drive — what the 0.3 V/µs number actually limits

At 0.3 V/µs, this part isn't chasing fast edges. A full 5 V swing takes about 17 µs, so it's fine for audio, sensor filtering, or control loops, but not for pulse-width modulation or high-speed comparator outputs. Each channel can source or sink 68 mA, enough to drive a headphone or a small relay coil directly, though the thermal limits of the tiny UCSP package will be the real ceiling at continuous high current.

Package realities for the rework bench

The 8-UCSP (1.6x1.6 mm) is a wafer-level chip-scale package — no leads, just solder bumps on the bottom. That means the board footprint is the die size plus a few tenths of a millimeter. Replacing one without a hot-air station and a microscope is not happening. Active lifecycle status means no end-of-life surprise for a current design.

Frequently asked questions

Is MAX4252EBL+T suitable for battery-powered applications?

Yes. The 420 µA supply current per channel and 2.4 V minimum supply make it a strong fit for 3 V or single-cell Li-ion designs. The rail-to-rail output preserves dynamic range at low supply voltages. The 0.3 V/µs slew rate is adequate for audio and slow sensor signals, but not for high-speed ADC driving.

What are the alternatives to MAX4252EBL+T?

Within the same family, the MAX4252ESA comes in an 8-SOIC package — same electrical specs, larger footprint, easier to rework. The MAX4252EUK+T is a single-channel version in SOT-23-5. Both are active and share the same 3 MHz GBW, 420 µA supply, and 70 µV offset. For a pin-compatible drop-in, the UCSP package is unique to the EBL+T variant; no direct second-source exists with the same bump layout.