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Analog Devices MAX3736ETE+T — Memory (DRAM / SRAM / Flash / EEPROM)

MAX3736ETE+T Laser Diode Driver, 3.2 Gbps, 16-TQFN

MPNMAX3736ETE+T
End of Life

Maxim Integrated MAX3736ETE+T, Laser Diode Driver (Fiber Optic), 3.2 Gbps, 85 mA modulation, 2.97-3.63 V supply, 16-WFQFN Exposed Pad, -40 to 85°C.

$11.9Ref. price · indicative, final on quote
Packaging16-WFQFN Exposed Pad
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MAX3736ETE+T Technical Specifications
ParameterValue
TypeLaser Diode Driver (Fiber Optic)
Mounting typeSurface Mount
Voltage2.97V ~ 3.63V
Current - bias100 mA
Current - supply22 mA
Current - modulation85mA
Operating temperature-40°C ~ 85°C
PackageTape & Reel (TR); Cut Tape (CT)
Data rate3.2Gbps
Case16-WFQFN Exposed Pad
Number of channels1

Product details

What this laser driver does on the bench

The Maxim Integrated MAX3736ETE+T is a single-channel laser diode driver built for fiber-optic transceiver modules. It handles data rates up to 3.2 Gbps, with a bias current of 100 mA and modulation current of 85 mA — enough to drive common SFP and GBIC laser diodes. The supply range runs from 2.97 V to 3.63 V, and the part is specified across -40°C to 85°C, so it fits both central-office and outdoor-cabinet temperature profiles. Housed in a 16-TQFN (3x3 mm) with an exposed pad, it's a surface-mount part that needs a solid thermal via pattern under the pad to pull heat out of the laser output stage.

3.2 Gbps data rate — what it means for the link budget

At 3.2 Gbps the driver supports Fibre Channel and Gigabit Ethernet rates with margin. The 85 mA modulation current is the peak-to-peak swing into the laser;.

Lifecycle and sourcing posture

The MAX3736ETE+T carries an Active lifecycle status and is ROHS3 compliant. No end-of-life notice or last-time-buy window has been announced. This part is sourced and quoted to order through independent distribution; submit an RFQ to confirm availability and pricing.

Package and footprint notes

The 16-TQFN (3x3 mm) package has an exposed pad on the bottom — that's the main thermal path. The datasheet recommends a 2x2 array of thermal vias under the pad, tied to a ground plane. The part is supplied in Tape & Reel (TR) or Cut Tape (CT) options, so it's pick-and-place ready for reflow assembly.

Frequently asked questions

What are the key specifications of the MAX3736ETE+T?

Engineers need to verify if the part meets their design requirements before specification.

Where can I buy the MAX3736ETE+T and what is its price?

Sourcing buyers need to check availability and cost to fill BOM lines quickly.

What is the life cycle status of the MAX3736ETE+T? Is it obsolete?

Brokers and procurement need to ensure long-term supply and avoid sourcing obsolete parts.

What is a compatible substitute for the MAX3736ETE+T?

Design and maintenance teams need alternatives in case of shortage or second-source requirements.

What is the package and pinout of the MAX3736ETE+T?

Layout engineers need physical dimensions and pin assignments for PCB design.

What is the lead time for MAX3736ETE+T?

Buyers need to plan production schedules based on delivery timelines.