Package and footprint
Housed in a 20-SSOP (0.209", 5.30 mm width) surface-mount package, the MAX3320TEAP+ fits a compact PCB layout. The supplier device package is 20-SSOP, so the land pattern is standard for that footprint family. No through-hole or wide-body variant exists for this order code.
Lifecycle and compliance
Marked as Active in the production lifecycle — no end-of-life notice, no last-time-buy window. ROHS3 compliant per, covering the current EU RoHS exemption set. No lead-free reflow concerns.
