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Analog Devices MAX32666GXMBL+ — Discrete Semiconductors

MAX32666GXMBL+ ARM Cortex-M4F Dual-Core MCU, 96MHz

MPNMAX32666GXMBL+
End of Life

Maxim Integrated DARWIN series MAX32666GXMBL+, dual-core ARM Cortex-M4F 32-bit MCU, 96MHz, 1MB Flash, 560KB SRAM, 121-CTBGA (8x8mm), -40°C to 105°C, 50 I/O, wide supply 0.72V-3.6V.

$14.49Ref. price · indicative, final on quote
Packaging121-LFBGA
StockContact for availability
MOQ1 pcs
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Specifications

MAX32666GXMBL+ Technical Specifications
ParameterValue
SeriesDARWIN
Mounting typeSurface Mount
Oscillator typeExternal, Internal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))0.72V ~ 3.6V
Operating temperature-40°C ~ 105°C (TA)
Speed96MHz
PackageTray
RAM size560K x 8
Core size32-Bit
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityeMMC/SD/SDIO, I²C, SPI, UART/USART, USB
Number of i (O)50
Core processorARM® Cortex®-M4F
Case121-LFBGA
Data convertersA/D 8x10b Sigma-Delta
Program memory size1MB (1M x 8)

Product details

Dual-core M4F at 96 MHz — what the clock buys you

The MAX32666GXMBL+ runs two ARM Cortex-M4F cores at 96 MHz, each with a single-precision FPU and DSP extensions. That dual-core architecture lets one core handle real-time control loops or sensor fusion while the other manages the wireless stack or data logging — no context-switching overhead. For a design that needs deterministic response on one thread and throughput on another, this avoids the scheduler tax a single-core part would pay. Program memory is 1 MB of Flash, sized for complex firmware with over-the-air update capabilities; the 560 KB SRAM holds large audio buffers, image frames, or protocol stacks without external memory. The 50 general-purpose I/Os, combined with eMMC/SD/SDIO, USB, I²C, SPI, and UART/USART, cover peripheral-rich applications like wearable gateways, portable medical devices, and industrial IoT edge nodes.

Industrial temperature and wide supply — deployment envelope

Rated -40°C to 105°C ambient, this MCU fits outdoor telecom cabinets, engine-bay controllers, and factory-floor automation where the enclosure sees thermal cycling. The supply range spans 0.72 V to 3.6 V.

Package and assembly constraints

Housed in a 121-ball CTBGA (8x8 mm), this is a fine-pitch BGA. That means the PCB requires controlled via-in-pad or microvia fanout, and assembly needs X-ray inspection for solder-joint verification.

Lifecycle and sourcing posture

ROHS3 compliant. For volume BOM commitments, this part is specified into new designs with confidence; no forced migration horizon.

Frequently asked questions

Is MAX32666GXMBL+ compatible with 3.3V logic?

Yes. Its supply range of 0.72 V to 3.6 V covers 3.3 V operation directly, so no external level shifter is needed for 3.3 V peripherals.

What is the closest pin-compatible alternative or replacement for MAX32666GXMBL+?

Within the DARWIN series, the MAX32666 family shares the same dual-core M4F architecture and 121-CTBGA footprint across density options. The evidence does not list a specific cross-reference part; for pin compatibility, compare the memory and peripheral set of other MAX32666 variants in the same 121-BGA package.