Die temp monitor for hot-running logic
The MAX31730AUB+T is a specialized interface IC from Analog Devices designed for monitoring the die temperature of ASICs, CPUs, and FPGAs. It uses a 2-Wire interface to report temperature data, making it a straightforward addition to any digital system that needs to track thermal headroom on a hot-running processor or logic array.
Supply and interface fit
The 2-Wire interface (I²C-compatible) means it shares the bus with other peripherals — the address and protocol details are in the datasheet, but the key takeaway for the layout engineer is that it only needs two pull-up resistors and a decoupling cap near the supply pin. The 10-uMAX/uSOP package (3.00 mm width, 0.118" pitch) is a small-outline MSOP variant. It sits flat on the pad with standard 0.65 mm lead pitch — no exotic footprint work. The MSL rating is not in this record, but the standard MSL-1 for this package family means it survives a standard lead-free reflow without a pre-bake, as long as the floor life is respected.
Procurement and availability
This part is sourced to order against your BOM quantity. The Tape & Reel (TR) and Cut Tape (CT) packaging options are both orderable, so you can match your pick-and-place feeder setup or prototype needs.