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Analog Devices MAX25221CATJ/V+ — Discrete Semiconductors

MAX25221CATJ/V+ Analog Devices 4-Ch Auto TFT LCD Pwr IC

MPNMAX25221CATJ/V+
End of Life

Analog Devices MAX25221CATJ/V+ automotive TFT LCD power supply IC, 4-channel, AEC-Q100, 32-TQFN (5x5 mm), -40 to +125°C, 2.65-5.5 V supply, 1.5 mA supply current, ROHS3.

$2.71Ref. price · indicative, final on quote
Packaging32-WFQFN Exposed Pad
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MAX25221CATJ/V+ Technical Specifications
ParameterValue
Mounting typeSurface Mount
Voltage2.65V ~ 5.5V
Current - supply1.5mA
Operating temperature-40°C ~ 125°C (TA)
GradeAutomotive
PackageTray
ApplicationsPower Supplies
QualificationAEC-Q100
Case32-WFQFN Exposed Pad

Product details

Active production, AEC-Q100 qualified

The MAX25221CATJ/V+: AEC-Q100 qualification (Grade 1 implied by the -40°C to +125°C operating range) means the part has passed the full automotive reliability stress battery: temperature cycling, ESD, latch-up, and high-temperature operating life. Tier-one ECU programs can accept it with PPAP documentation from Analog Devices.

Four-channel TFT power rail architecture

This is a four-channel automotive TFT LCD power supply IC — it integrates the gate-drive supply, logic supply, and source-driver rails needed for a center-stack infotainment display or instrument cluster panel. The 2.65 V to 5.5 V input range lets it run from a 3.3 V or 5 V rail common in automotive power trees, or from a battery-backed 3.0 V coin cell during key-off sleep. The 1.5 mA quiescent current is low enough that the part does not dominate the system sleep budget.

32-TQFN exposed-pad footprint

Packaged in a 32-WFQFN with exposed pad (5x5 mm body, 0.5 mm pitch). The thermal pad must be soldered to a PCB copper plane to keep the junction-to-ambient thermal resistance within the datasheet limit — a 2x2 via array under the pad is standard practice. Surface-mount assembly: the 0.5 mm pitch requires a solder-paste stencil aperture matched to the land pattern and a reflow profile that does not exceed the 260°C peak body temperature for the lead-free finish.

ROHS3 compliance and supply posture

ROHS3 compliant — no exemptions for lead in solder or PBB/PBDE flame retardants. The tin-plated termination finish is compatible with standard lead-free reflow profiles. Sourced to order against the BOM quantity through independent distribution.

Frequently asked questions

What package does MAX25221CATJ/V+ come in?

It is packaged in a 32-WFQFN with exposed pad (5x5 mm body, 0.5 mm pitch), supplier device package 32-TQFN (5x5). The exposed pad must be soldered to a PCB copper plane for thermal management.