2.5 GHz power amplifier for Bluetooth and cordless phone front-ends
The Maxim Integrated MAX2246EBL+T is a 2.5 GHz power amplifier delivering 22 dBm and 20 dBm output power, designed specifically for Bluetooth and cordless phone transmitter chains. It comes in a 9-ball WFBGA/CSPBGA package (9-UCSP, 1.52x1.52 mm) for surface-mount assembly.
Output power and application fit
The headline output figures — 22 dBm and 20 dBm at 2.5 GHz — define this amplifier's place in the RF chain. These levels are typical for Class 1 Bluetooth transmitters and cordless phone handsets where the PA needs to boost a radio's output to the +20 dBm regulatory limit without excessive current draw. The 2.5 GHz center frequency also covers the 2.4–2.5 GHz ISM band used by Bluetooth Basic Rate/EDR and many cordless phone standards.
Package realities for layout and rework
The 9-ball CSP (chip-scale package) at 1.52x1.52 mm is a fine-pitch, no-lead array. The solder balls are under the package body — no peripheral leads to probe or hand-solder. Layout needs a matching ground-plane cutout and via array under the center pad for thermal and RF grounding. Rework requires a hot-air station with a fine nozzle; the small body makes alignment critical. MSL level should be confirmed before the bake decision, but any CSP from a moisture-sealed bag that has been open beyond the floor-life window needs a pre-reflow bake.
Sourcing and lifecycle posture
For a production BOM line, this removes the urgency to qualify a second source or stockpile ahead of an EOL.