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Analog Devices MAX17761ATC+ — Interface & Transceivers
Analog Devices

MAX17761ATC+ Analog Devices Buck Regulator, 1A, 76V Input

MPNMAX17761ATC+
End of Life

Analog Devices MAX17761ATC+ step-down buck regulator, 1A output, 4.5V to 76V input, adjustable output, 12-WFDFN exposed pad tray.

$6.55Ref. price · indicative, final on quote
Packaging12-WFDFN Exposed Pad
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MAX17761ATC+ Technical Specifications
ParameterValue
Output typeAdjustable
Mounting typeSurface Mount
Voltage - input4.5V
Voltage - output68.4V
Voltage - output (Min (Fixed))0.8V
Current - output1A
Frequency200kHz ~ 600kHz
Number of outputs1
Operating temperature-40°C ~ 125°C (TA)
PackageTray
FunctionStep-Down
TopologyBuck
Case12-WFDFN Exposed Pad
Output configurationPositive
Synchronous rectifierYes

Product details

Wide-input buck regulator in a 3x3 TDFN

The MAX17761ATC+ is a step-down (buck) switching regulator from Analog Devices, delivering up to 1A of continuous output current from a 4.5V to 76V input rail. The output is adjustable from 0.8V up to 68.4V, making it suitable for generating a wide range of regulated voltages from high-voltage supplies like 48V telecom or 72V industrial buses.

Switching frequency and efficiency

The switching frequency is programmable via an external resistor from 200 kHz to 600 kHz, allowing the designer to trade off inductor size against switching losses. An integrated synchronous rectifier eliminates the need for an external freewheeling diode, improving efficiency at the 1A load point.

Package and thermal performance

Housed in a 12-lead WFDFN with an exposed pad (3 mm x 3 mm TDFN package), the MAX17761ATC+ relies on the pad soldered to the PCB ground plane for heat dissipation.