The MAX17561AUD+: Housed in a 14-TSSOP with exposed pad (14-TSSOP-EP), the package provides a low thermal resistance path from the die to the PCB copper plane. The exposed paddle must be soldered to a thermal land on the board to achieve the rated power dissipation; the datasheet layout recommendation should be followed for the pad pattern and via array.
Compliance and packaging
ROHS3 compliant. Supplied in tube packaging.
