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Analog Devices MAX17557ATP+T — DC-DC Power Modules

MAX17557ATP+T Analog Devices DC-DC Power Module, 4.5-60V

MPNMAX17557ATP+T
End of Life

Analog Devices MAX17557ATP+T DC-DC Power Module, Step-Down, Buck, 4.5V to 60V input, 100kHz to 2.2MHz switching, 20-TQFN (4x4) package, Tape & Reel.

$6.5Ref. price · indicative, final on quote
Packaging20-WFQFN Exposed Pad
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MAX17557ATP+T Technical Specifications
ParameterValue
Output typeTransistor Driver
Mounting typeSurface Mount
Voltage - supply (Vcc (Vdd))4.5V ~ 60V
Frequency100kHz ~ 2.2MHz
Number of outputs1
Output phases1
Operating temperature-40°C ~ 125°C
PackageTape & Reel (TR); Cut Tape (CT)
FunctionStep-Down
TopologyBuck
Clock syncNo
Case20-WFQFN Exposed Pad
Control featuresEnable
Output configurationPositive
Synchronous rectifierYes

Product details

Wide-input external-FET buck controller

The MAX17557ATP+T is an external-FET step-down controller from Analog Devices, designed for applications requiring a 4.5V to 60V input range and a single positive output up to 2.2 MHz switching frequency. Synchronous rectification is built in, which improves efficiency by replacing the freewheeling diode with a low-Rds(on) FET — the controller drives both the high-side and low-side external MOSFETs. The 100 kHz to 2.2 MHz programmable switching range lets the designer balance inductor size against switching losses; a higher frequency shrinks the magnetics but increases FET gate-drive losses.

Temperature grade and package for industrial use

Housed in a 20-lead TQFN with exposed pad (4x4 mm), the package provides a low thermal resistance path to the PCB copper plane — essential for dissipating heat from the internal gate-drive circuitry and the external FET switching losses. Surface-mount assembly with the exposed pad soldered to a thermal land on the PCB; the datasheet layout recommendation specifies a 4x4 mm pad with via array to the inner ground plane.

Available in tape-and-reel (TR) or cut-tape (CT) quantities, the part is suited for both prototype builds and production reels.

Frequently asked questions

What package does MAX17557ATP+T come in?

It is supplied in a 20-lead TQFN with exposed pad (4x4 mm), surface-mount, available in tape-and-reel or cut-tape.