Package and mounting
The 10-TDFN (3x2 mm) exposed-pad package requires soldering the thermal pad to a copper land on the PCB, connected to the ground plane with vias for heat dissipation. Reflow is the intended attach method.
Lifecycle and sourcing posture
The MAX17552ATB+T is listed as Active with ROHS3 compliance. No end-of-life notice or last-time-buy window has been published. It is part of the Himalaya family, which Maxim (now Analog Devices) continues to support. For a BOM line that needs a wide-input, low-current buck, this part is a current-production choice — no LTB risk on the horizon.
