Package and thermal — the exposed-pad requirement
The MAX16928BGUP/V+ comes in a 20-TSSOP package with an exposed pad. That pad is the primary thermal path — without a proper via stitch to the ground plane on the PCB, the junction temperature will exceed the 105°C limit under continuous load. The pad also serves as the electrical ground connection, so the layout needs a solid thermal land pattern with multiple vias to the inner-layer copper pour.
Lifecycle and sourcing — active, no LTB risk
The MAX16928BGUP/V+ is listed as Active with a current lifecycle stage. The part is ROHS3 compliant, so it meets the EU RoHS exemption regime for automotive applications.