Package and board-fit — 28-TQFN with exposed pad
The MAX16050ETI+T comes in a 28-WFQFN Exposed Pad package (supplier device package 28-TQFN, 4x4 mm). That exposed paddle underneath is the main thermal path and also the ground connection — the PCB layout needs a matching thermal pad with a via array to the ground plane, or the part will run hot and the soldering may not wet properly. It is a surface-mount part (Mounting Type: Surface Mount), so no socket, no field swap without a reflow station. If you are repairing a board in the field, this is not a part you change on site with a soldering iron — the QFN footprint demands hot air or a reflow oven.
What it does — power supply monitoring and sequencing
This IC is a power supply monitor and sequencer (Applications: Power Supply Monitor, Sequencer). It watches multiple voltage rails and controls the order they turn on and off — critical in systems where one rail must stabilize before another powers up, like FPGAs, SoCs, or mixed-signal boards with separate analog and digital supplies. The chip itself draws 700 µA (Current - Supply: 700 µA) — that is its own operating current, not the load it monitors. That 700 µA is low enough to keep the thermal budget tight even in a small QFN package. It works in most factory-floor enclosures, outdoor telecom cabinets, and HVAC controllers. Not rated for under-hood automotive or engine-bay use — that would need a -40 to +125 °C part.
Sourced to order against an RFQ through independent and authorized distribution.